$Taiwan Semiconductor Manufacturing(TSM)$
The technological trend of optoelectronic integration, such as CPO (Co-Packaged Optics) and OIO (Optical Input/Output), is becoming increasingly evident, especially as CPO switches transition from the laboratory phase to commercialization in 2025. With the establishment and release of TSMC's (Taiwan Semiconductor Manufacturing Company, referred to as "American TSMC" in the context of its U.S. production capacity) manufacturing capacity in the United States, there will be a continuous increase in orders for both traditional advanced process CPU/GPU/ASIC chips and new optoelectronic integrated chips. For stock prices, this almost creates a situation where valuation and performance both increase.
Later, I will provide a detailed analysis of the technical background, platform architecture, technical advantages, and potential challenges of TSMC's silicon photonics platform COUPE.
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