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Why Intel Hired the Former CEO of Micron's Big Rival SK Hynix

Intel has just made a big-name hire, bringing in former SK Hynix CEO Seok-Hee Lee. While that might generate some speculation about a move to rival Micron Technology in memory chips, investors should probably focus on Intel's chip-packaging plans.Intel said late Thursday that it had appointed Lee as executive vice president of Intel Foundry, its chip-manufacturing business, reporting directly to CEO Lip-Bu Tan.Lee previously led South Korean memory-chip maker SK Hynix. At one point Intel was a world leader in memory chips -- now arguably the hottest sector in the artificial-intelligence trade -- but gradually exited the business, and in fact agreed to sell the remainder of its flash-memory business to SK Hynix in 2020."Seok-Hee's insights will help Intel further strengthen our system integration capabilities," said Intel CEO Lip-Bu Tan in a statement Thursday. "He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced pack

Why Intel Hired the Former CEO of Micron's Big Rival SK Hynix

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{"i18n":{"language":"en_US"},"data":{"magic":2,"id":577833046683984,"tweetId":"577833046683984","gmtCreate":1782097427222,"gmtModify":1782097429459,"author":{"id":3581908128241242,"idStr":"3581908128241242","authorId":3581908128241242,"authorIdStr":"3581908128241242","name":"Impure88","avatar":"https://static.laohu8.com/default-avatar.jpg","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":6,"crmLevelSwitch":0,"currentWearingBadge":{"badgeId":"7a9f168ff73447fe856ed6c938b61789-1","templateUuid":"7a9f168ff73447fe856ed6c938b61789","name":"Knowledgeable Investor","description":"Traded more than 10 stocks","bigImgUrl":"https://static.tigerbbs.com/e74cc24115c4fbae6154ec1b1041bf47","smallImgUrl":"https://static.tigerbbs.com/d48265cbfd97c57f9048db29f22227b0","grayImgUrl":"https://static.tigerbbs.com/76c6d6898b073c77e1c537ebe9ac1c57","redirectLinkEnabled":0,"hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.03.04","individualDisplayEnabled":0},"individualDisplayBadges":[],"wearingBadges":[{"badgeId":"7a9f168ff73447fe856ed6c938b61789-1","name":"Knowledgeable Investor","description":"Traded more than 10 stocks","smallImgUrl":"https://static.tigerbbs.com/d48265cbfd97c57f9048db29f22227b0","bigImgUrl":"https://static.tigerbbs.com/e74cc24115c4fbae6154ec1b1041bf47","isScarce":0,"effectEnabled":0,"redirectLinkEnabled":0,"redirectLinkValidityFrom":0,"redirectLinkValidityTo":9223372036854776000}],"fanSize":2,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"title":"","html":"<html><head></head><body><p>&nbsp;\"<a href=\"https://ttm.financial/U/3527667621665671\">@Daily_Discussion </a> s</p></body></html>","htmlText":"<html><head></head><body><p>&nbsp;\"<a href=\"https://ttm.financial/U/3527667621665671\">@Daily_Discussion </a> s</p></body></html>","text":"\"@Daily_Discussion s","highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://ttm.financial/post/577833046683984","repostId":2644562057,"repostType":2,"repost":{"id":"2644562057","kind":"highlight","weMediaInfo":{"introduction":"Dow Jones publishes the world’s most trusted business news and financial information in a variety of media.","home_visible":0,"media_name":"Dow Jones","id":"106","head_image":"https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99"},"pubTimestamp":1782096199,"share":"https://ttm.financial/m/news/2644562057?lang=en_US&edition=fundamental","pubTime":"2026-06-22 10:43","market":"sh","language":"en","title":"Why Intel Hired the Former CEO of Micron's Big Rival SK Hynix","url":"https://stock-news.laohu8.com/highlight/detail?id=2644562057","media":"Dow Jones","summary":"Intel has just made a big-name hire, bringing in former SK Hynix CEO Seok-Hee Lee. While that might generate some speculation about a move to rival Micron Technology in memory chips, investors should probably focus on Intel's chip-packaging plans.Intel said late Thursday that it had appointed Lee as executive vice president of Intel Foundry, its chip-manufacturing business, reporting directly to CEO Lip-Bu Tan.Lee previously led South Korean memory-chip maker SK Hynix. At one point Intel was a world leader in memory chips -- now arguably the hottest sector in the artificial-intelligence trade -- but gradually exited the business, and in fact agreed to sell the remainder of its flash-memory business to SK Hynix in 2020.\"Seok-Hee's insights will help Intel further strengthen our system integration capabilities,\" said Intel CEO Lip-Bu Tan in a statement Thursday. \"He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced pack","content":"<html><head></head><body><p style=\"text-align: left;\">Intel has just made a big-name hire, bringing in former SK Hynix CEO Seok-Hee Lee. While that might generate some speculation about a move to rival Micron Technology in memory chips, investors should probably focus on Intel&#39;s chip-packaging plans.</p><p style=\"text-align: left;\">Intel said late Thursday that it had appointed Lee as executive vice president of Intel Foundry, its chip-manufacturing business, reporting directly to CEO Lip-Bu Tan.</p><p style=\"text-align: left;\">Lee previously led South Korean memory-chip maker SK Hynix. At one point Intel was a world leader in memory chips -- now arguably the hottest sector in the artificial-intelligence trade -- but gradually exited the business, and in fact agreed to sell the remainder of its flash-memory business to SK Hynix in 2020.</p><p style=\"text-align: left;\">Lee&#39;s appointment is unlikely to signal a return to the memory business for Intel. Instead, it looks like a move to strengthen its chip-packaging expertise. Intel said Lee will lead advanced packaging, system integration and back-end manufacturing.</p><p style=\"text-align: left;\">&#34;Seok-Hee&#39;s insights will help Intel further strengthen our system integration capabilities,&#34; said Intel CEO Lip-Bu Tan in a statement Thursday. &#34;He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T...to high volume for customers and partners.&#34;</p><p style=\"text-align: left;\">Still, Lee&#39;s previous experience at SK Hynix might be important for another reason. Intel was recently reported to be in talks with SK Hynix about integrating high-bandwidth memory and logic chips, according to a report from ZDNet Korea.</p><p style=\"text-align: left;\">A deal with SK Hynix would be significant validation for Intel&#39;s embedded multi-die interconnect Bridge, or EMIB, technology. Intel has been promoting the packaging technology as a rival to <a href=\"https://laohu8.com/S/TSM\">Taiwan Semiconductor Manufacturing</a>&#39;s chip-on-wafer-on-substrate, or CoWoS.</p><p style=\"text-align: left;\">Intel stock has risen more than 500% in the past 12 months, and much of that excitement is based on expectations its Foundry unit can finally attract external customers to offset the billions of losses the company has booked on its chip-manufacturing operations. Wall Street analysts think chip packaging is a key part of that, offering a low-risk way for clients to begin working with Intel.</p><p style=\"text-align: left;\">&#34;Assuming Intel can make packaging scale reliably, we believe it can become a notable customer acquisition channel for the broader foundry platform by giving Intel just a shot of momentum,&#34; wrote D.A. Davidson analyst Gil Luria in a recent research note.</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Why Intel Hired the Former CEO of Micron's Big Rival SK Hynix</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nWhy Intel Hired the Former CEO of Micron's Big Rival SK Hynix\n</h2>\n\n<h4 class=\"meta\">\n\n\n<div class=\"head\" \">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Dow Jones </p>\n<p class=\"h-time\">2026-06-22 10:43</p>\n</div>\n\n</div>\n\n\n</h4>\n\n</header>\n<article>\n<html><head></head><body><p style=\"text-align: left;\">Intel has just made a big-name hire, bringing in former SK Hynix CEO Seok-Hee Lee. While that might generate some speculation about a move to rival Micron Technology in memory chips, investors should probably focus on Intel&#39;s chip-packaging plans.</p><p style=\"text-align: left;\">Intel said late Thursday that it had appointed Lee as executive vice president of Intel Foundry, its chip-manufacturing business, reporting directly to CEO Lip-Bu Tan.</p><p style=\"text-align: left;\">Lee previously led South Korean memory-chip maker SK Hynix. At one point Intel was a world leader in memory chips -- now arguably the hottest sector in the artificial-intelligence trade -- but gradually exited the business, and in fact agreed to sell the remainder of its flash-memory business to SK Hynix in 2020.</p><p style=\"text-align: left;\">Lee&#39;s appointment is unlikely to signal a return to the memory business for Intel. Instead, it looks like a move to strengthen its chip-packaging expertise. Intel said Lee will lead advanced packaging, system integration and back-end manufacturing.</p><p style=\"text-align: left;\">&#34;Seok-Hee&#39;s insights will help Intel further strengthen our system integration capabilities,&#34; said Intel CEO Lip-Bu Tan in a statement Thursday. &#34;He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T...to high volume for customers and partners.&#34;</p><p style=\"text-align: left;\">Still, Lee&#39;s previous experience at SK Hynix might be important for another reason. Intel was recently reported to be in talks with SK Hynix about integrating high-bandwidth memory and logic chips, according to a report from ZDNet Korea.</p><p style=\"text-align: left;\">A deal with SK Hynix would be significant validation for Intel&#39;s embedded multi-die interconnect Bridge, or EMIB, technology. Intel has been promoting the packaging technology as a rival to <a href=\"https://laohu8.com/S/TSM\">Taiwan Semiconductor Manufacturing</a>&#39;s chip-on-wafer-on-substrate, or CoWoS.</p><p style=\"text-align: left;\">Intel stock has risen more than 500% in the past 12 months, and much of that excitement is based on expectations its Foundry unit can finally attract external customers to offset the billions of losses the company has booked on its chip-manufacturing operations. Wall Street analysts think chip packaging is a key part of that, offering a low-risk way for clients to begin working with Intel.</p><p style=\"text-align: left;\">&#34;Assuming Intel can make packaging scale reliably, we believe it can become a notable customer acquisition channel for the broader foundry platform by giving Intel just a shot of momentum,&#34; wrote D.A. Davidson analyst Gil Luria in a recent research note.</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LINT":"Direxion Daily INTC Bull 2X ETF","LU2357627491.SGD":"TRP GLOBAL VALUE EQUITY \"AH\" (SGDHDG) ACC","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU0097036916.USD":"贝莱德美国增长A2 USD","BK4554":"元宇宙及AR概念","LU2720916845.USD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (USD) ACC","HK0000304805.HKD":"PICTET 战略收益基金 P类港元","BK4512":"苹果概念","BK4543":"AI","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","BK4527":"明星科技股","HK0000304797.USD":"PICTET 战略收益基金 P类 美元","LU2764263039.SGD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (SGDHDG) ACC","INTW":"2倍做多INTC ETF-GraniteShares","BK4585":"ETF&股票定投概念","BK4534":"瑞士信贷持仓","BK4141":"半导体产品","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","LU2764263203.CNY":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (CNYHDG) ACC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","LU0082616367.USD":"摩根大通美国科技A（dist）","BK4529":"IDC概念","BK4602":"量子计算概念","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","BK4575":"芯片概念","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","INTC":"英特尔","LU2764262908.HKD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (HKD) ACC","BK4535":"淡马锡持仓","LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","BK4515":"5G概念","BK4612":"AI芯片","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","IE000M9KFDE8.USD":"NEUBERGER BERMAN US LARGE CAP VALUE \"A\" (USD) ACC","LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","BK4588":"碎股","BK4579":"人工智能","BK4550":"红杉资本持仓","LU0859254822.USD":"T ROWE PRICE GLOBAL VALUE EQUITY \"A\" (USD) ACC","BK4605":"半导体精选","LU0149725797.USD":"汇丰美国股市经济规模基金"},"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2644562057","content_text":"Intel has just made a big-name hire, bringing in former SK Hynix CEO Seok-Hee Lee. While that might generate some speculation about a move to rival Micron Technology in memory chips, investors should probably focus on Intel's chip-packaging plans.Intel said late Thursday that it had appointed Lee as executive vice president of Intel Foundry, its chip-manufacturing business, reporting directly to CEO Lip-Bu Tan.Lee previously led South Korean memory-chip maker SK Hynix. At one point Intel was a world leader in memory chips -- now arguably the hottest sector in the artificial-intelligence trade -- but gradually exited the business, and in fact agreed to sell the remainder of its flash-memory business to SK Hynix in 2020.Lee's appointment is unlikely to signal a return to the memory business for Intel. Instead, it looks like a move to strengthen its chip-packaging expertise. Intel said Lee will lead advanced packaging, system integration and back-end manufacturing.\"Seok-Hee's insights will help Intel further strengthen our system integration capabilities,\" said Intel CEO Lip-Bu Tan in a statement Thursday. \"He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T...to high volume for customers and partners.\"Still, Lee's previous experience at SK Hynix might be important for another reason. Intel was recently reported to be in talks with SK Hynix about integrating high-bandwidth memory and logic chips, according to a report from ZDNet Korea.A deal with SK Hynix would be significant validation for Intel's embedded multi-die interconnect Bridge, or EMIB, technology. Intel has been promoting the packaging technology as a rival to Taiwan Semiconductor Manufacturing's chip-on-wafer-on-substrate, or CoWoS.Intel stock has risen more than 500% in the past 12 months, and much of that excitement is based on expectations its Foundry unit can finally attract external customers to offset the billions of losses the company has booked on its chip-manufacturing operations. Wall Street analysts think chip packaging is a key part of that, offering a low-risk way for clients to begin working with Intel.\"Assuming Intel can make packaging scale reliably, we believe it can become a notable customer acquisition channel for the broader foundry platform by giving Intel just a shot of momentum,\" wrote D.A. Davidson analyst Gil Luria in a recent research note.","news_type":1,"symbols_score_info":{"LINT":0.6,"INTW":0.6,"INTC":1.97}},"isVote":1,"tweetType":1,"viewCount":14,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"EN","currentLanguage":"EN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":19,"optionInvolvedFlag":false,"xxTargetLangEnum":"ORIG"},"commentList":[],"hasMoreComment":false,"orderType":2}