FUTURUM JUST MAPPED EVERY LAYER OF THE CPU SUPPLY CHAIN
FUTURUM JUST MAPPED EVERY LAYER OF THE CPU SUPPLY CHAIN
CPU Architecture & IP
• Arm: $ARM Holdings(ARM)$
• Proprietary: $IBM(IBM)$
• x86: $Advanced Micro Devices(AMD)$ $Intel(INTC)$
Chip Design Software
• EDA: $Cadence Design(CDNS)$ $Synopsys(SNPS)$
Manufacturing
• Memory: $Micron Technology(MU)$ $SK hynix(SKHY)$
• Foundries: $Taiwan Semiconductor Manufacturing(TSM)$ $Intel(INTC)$ $GLOBALFOUNDRIES Inc.(GFS)$
• Advanced Packaging: $Taiwan Semiconductor Manufacturing(TSM)$ $Intel(INTC)$ $Amkor Technology(AMKR)$
• Wafer Fab Equipment: $ASML Holding NV(ASML)$ $Applied Materials(AMAT)$ $Lam Research(LRCX)$ $KLA Corporation(KLAC)$
CPU End Markets
• Enterprise: $Advanced Micro Devices(AMD)$ $Intel(INTC)$ $IBM(IBM)$
• Mobile: $Apple(AAPL)$ $Qualcomm(QCOM)$$Alphabet(GOOGL)$
• Consumer: $Advanced Micro Devices(AMD)$ $Intel(INTC)$ $Apple(AAPL)$ $Qualcomm(QCOM)$
• Agentic AI: $ARM Holdings(ARM)$ $NVIDIA(NVDA)$ $Qualcomm(QCOM)$ $Advanced Micro Devices(AMD)$$Intel(INTC)$
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